Study on the relationship between surface and dislocation of nanoporous copper under cyclic shear loading

In this paper, molecular dynamics simulation is conducted to study the relationship between surface and dislocation of nanoporous copper under cyclic shear loading. The results show that have both mutual promotion competition relationship. On one hand, becomes rough owing reconstruction caused by shear, which promotes activities, while activities also accelerate process reconstruction. other there a activities: in early cycles, density low, dominates stress release; late tends be stable, then, dominate.